| 摘要 |
PROBLEM TO BE SOLVED: To provide a connection method wherein solder and a connection terminal are not used for connection of an electronic component, wiring or the like to an electronic substrate. SOLUTION: A positioning hole or a projection is provided to an electronic substrate 1, a positioning hole or a projection of an electronic component 5 or a wiring 3 is fit in the hole or the projection, and the electronic component 5 or the wiring 3 is fixed. After a heat shrinkable film 2 is attached to the electronic substrate 1 with the electronic component 5 and the wiring 3 attached, it is shrunk by heat. COPYRIGHT: (C)2004,JPO&NCIPI
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