| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent disconnection in a wire at sealing, and to prevent peeling in an interface between a sealing material and a substrate and disconnection of the wire even at a high temperature processing in a light emitting diode. <P>SOLUTION: In the light emitting diode 1, the light emitting element 3 is mounted on a ceramic substrate 2, and a surface electrode is bonded to a prescribed position of a circuit pattern 7 by two gold wires 4. A glass lens 5 is covered from above where a necessarily minimum space in which the light emitting element 3 and the wires 4 are stored and a resin injected hole 9a are formed. Sealing glass 8 is applied to four corners of plate-like parts of the glass lens 5 by a quarter of a circle. The plate-like part of the glass lens 5 and the ceramic substrate 2 are rigidly sealed at a high temperature (before or after 400°C). Transparent silicon resin 6 whose viscosity is low and which does not have possibility of disconnection of the wires 4 is injected from the resin injectied hole 9a after cooling. The space is filled with it and the light emitting element 3 and the wires 4 are sealed. Transparent silicon resin 6 is thermo-set and the diode is completed. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
