发明名称 |
Wiring connection structure of laminated capacitor and decoupling capacitor, and wiring board |
摘要 |
An apparatus is provided for packaging a laminated capacitor made to have a low ESL value and is used for a decoupling capacitor to be connected to a power supply circuit for a MPU chip providing a MPU. The laminated capacitor is accommodated within a cavity provided on a wiring board. The capacitor includes a plurality of first external terminal electrodes connected to first internal electrodes via a plurality of first feedthrough conductors and a plurality of second external terminal electrodes connected to second internal electrodes via a plurality of second feedthrough conductors. The first external terminal electrodes provided on a first major surface of a capacitor body are connected to via-hole conductors at the hot side for the power source within a substrate, and the second external terminal electrodes provided on first and second major surfaces are connected to grounding via-hole conductors and a mother board within the substrate.
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申请公布号 |
US2004140553(A1) |
申请公布日期 |
2004.07.22 |
申请号 |
US20040753004 |
申请日期 |
2004.01.08 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
NAITO YASUYUKI;TANIGUCHI MASAAKI;KURODA YOICHI;HORI HARUO;KONDO TAKANORI |
分类号 |
H01G4/30;H01L23/498;H01L23/66;H05K1/02;H05K1/18;(IPC1-7):H01L23/48;H01L29/40 |
主分类号 |
H01G4/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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