发明名称 SHEET MATERIAL AND WIRING BOARD
摘要 <p>A sheet material (1) which comprises an adhesive layer (2) and a high-strength layer (3) superposed on this adhesive layer (2). The adhesive layer (2) is made of an epoxy resin which is a thermosetting material. The high-strength layer (3) is made of a polyimide which does not soften at a temperature to be used for thermally curing the epoxy resin, has a tensile strength at break higher than that of the thermosetting material after cure, has a tensile strength at break as measured at 23°C of 100 MPa or higher and an elongation at break as measured at 23°C of 10% or higher and has an a/b ratio of 2.5 or lower, wherein a is the tensile strength at break as measured at -65°C and b is the tensile strength at break as measured at 150°C.</p>
申请公布号 WO2004060660(A1) 申请公布日期 2004.07.22
申请号 WO2003JP14732 申请日期 2003.11.19
申请人 NEC CORPORATION;MURAI, HIDEYA;SHIMOTO, NAONORI;BABA, KAZUHIRO;KIKUCHI, KATUMI 发明人 MURAI, HIDEYA;SHIMOTO, NAONORI;BABA, KAZUHIRO;KIKUCHI, KATUMI
分类号 B32B7/12;H05K3/46;(IPC1-7):B32B9/00 主分类号 B32B7/12
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