| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic package with improved temperature performance. SOLUTION: The electronic package (200) has a supporting electronic package, having improved thermal performance and a heat conductive substrate (210) having a first surface, including an extension part (212). It further includes a flexible circuit (205) and a cavity (230), extending through the flexible circuit (205), up to the heat conductive substrate (210). The flexible circuit (205) section of the electronic package (200) further includes a flexible dielectric layer (270), and the dielectric layer (270) has a first conductive layer (240), connected to a first surface of the dielectric layer (270), and a second conductive layer (245) that is connected to a second surface on a side opposite to the first surface, and connected to a second surface on a side opposite to the extension part (212) of the heat conductive substrate (210). COPYRIGHT: (C)2004,JPO&NCIPI |
