| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric module with improved ruggedness by preventing generation of chip due to thermal stress in the corner of the thermoelectric element. SOLUTION: A lower electrode 13 and an upper electrode 14 are formed in double-side in a lower substrate 11 and an upper substrate 12, respectively, which are arranged face to face. End surfaces of thermoelectric elements 15, 16 are fixed to the lower electrode 13 and the upper electrode 14, respectively, through lead free solder, thereby forming the thermoelectric module 10. The thermoelectric element 16 is arranged at a corner of the thermoelectric module 10. A slant face 16a is formed on the corner side of the module 10 in the element 16. By removing the corner of the element constituted of a rectangular parallelopiped, the slant face 16a is formed. COPYRIGHT: (C)2004,JPO&NCIPI
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