| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which can reduce the occurrence of the appearance fault of a lead and which can shape the leads so as to become substantially in parallel with one another. SOLUTION: A method for shaping a plurality of leads (e.g., 6E) led out of a body 4 of the semiconductor device includes a step of squeezing the leads in a tapered state by inserting the leads into a tapered hole by using a jig having the hole which has a predetermined tapered angle, and a step of spreading the leads substantially in parallel after the squeezing step. The spreading step spreads the lead between a supporting point and the tip of the lead by using the principle of a lever, in which the point of bringing the supporting point into contact with a left pawl 66 between the supporting point and the roots of the leads is used as a power point at one point of the lead 6E brought into contact with a central pawl 64 as a supporting point. COPYRIGHT: (C)2004,JPO&NCIPI
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