| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering land and a printed wiring board which are capable of restraining solder balls from being produced upon soldering by reflow heating, and realizing high density mounting. SOLUTION: As to the soldering land, the formed structure of a solder resist on a part of the land covered with a chip to mount is set different from that on the other part of the land not covered with the chip. Concretely, the solder resist is eliminated from only the area of the soldering land that is covered with the chip to mount. By this setup, solder protruding from the soldering land can be easily returned to the soldering land at reflow heating. COPYRIGHT: (C)2004,JPO&NCIPI
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