| 摘要 |
PROBLEM TO BE SOLVED: To prevent substrate processing equipment from deteriorating in throughput when a wafer measurement process is incorporated into a wafer transfer process in a method of manufacturing a semiconductor device in a batch production system. SOLUTION: The substrate processing equipment is equipped with a reaction chamber 19 where a plurality of substrates 23 are set to a substrate holder 22 for processing; a heating unit 18 heating the substrates introduced into the reaction chamber 19; a measuring device which measures the substrates; and a transfer device 8 which transfers the substrates to a substrate holder, the measurement device, and a transfer case 3. A process of measuring the substrate that has been subjected to processing with the measurement device, and another process of transferring the other substrate to the transfer case with the transfer device while the substrate is measured, are provided. COPYRIGHT: (C)2004,JPO&NCIPI
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