发明名称 |
SEALED AND PRESSURIZED LIQUID COOLING SYSTEM FOR MICROPROCESSOR |
摘要 |
According to some embodiments, a cooling system that may be installed in a computer chassis has a fluid-containing space that is sealed and pressurized by an inert gas. The fluid-containing space may be formed from a cold plate that may serve as a heat sink for an integrated circuit, a heat exchanger, tubing, and a pump volume. A coolant may be contained in the fluid-containing space. |
申请公布号 |
WO2004062094(A2) |
申请公布日期 |
2004.07.22 |
申请号 |
WO2003US39193 |
申请日期 |
2003.12.08 |
申请人 |
INTEL CORPORATION (A DELAWARE COPRPORATION) |
发明人 |
GWIN, PAUL;KONSTAD, ROLF;DAVISON, PETER;TRAUTMAN, MARK |
分类号 |
G06F1/20;H01L23/473;H05K7/20 |
主分类号 |
G06F1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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