MOLD APPARATUS INCLUDING CULL SENSOR AND MOLDING METHOD USING THE SAME

摘要

PURPOSE: A mold apparatus including a cull sensor and a molding method using the same are provided to detect easily a processing error in a molding process by sensing the thickness of cull before a degate process. CONSTITUTION: A chemical resin tubulate is pressed by a molding unit of a mold apparatus in order to surround a semiconductor chip with a chemical resin. The molded semiconductor chip and the remaining chemical resin such as a cull(32) is loaded into a degate unit of the molding unit. A processing error of a molding process is checked by sensing the thickness of the cull before the remaining chemical resin is separated from the molded semiconductor chip.