| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin sealed semiconductor device which can mount a large-sized semiconductor chip and cope with miniaturization and thinning. <P>SOLUTION: A lead part 9 for connecting a signal is connected with an outer lead part 10, and is supported by a frame 11. Then, a resin film 12 is adhered to at least the lead part 9 for connecting signal, the outer lead part 10, and the bottom surface of the frame 11. A die pad part 14 is fixed to the top of the resin film 12 exposed in an opening part 13 in which each end part of the lead part 9 for connecting signal extends to be arranged, so that, without a conventional suspending lead part, the die pad part 14 exists independently in the framework 11. Thereby, without enlarging the size of the resin sealed semiconductor device itself, the large-sized semiconductor chip can also be mounted. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
