| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing a semiconductor device having high reliability. SOLUTION: The method for manufacturing the semiconductor device includes the steps of setting a lead frame 50 placing a semiconductor chip 40 on a die pad 30 to a mold 10 for molding, limiting the movement of the die pad 30 in any direction for directing both the surfaces of the die pad 30 by one stopper 20, filling a cavity 14 with a resin 60 in the state that the movement of the die pad 30 is limited, removing the stopper 60 from the cavity 14 before curing of the resin 60 is finished, and curing the resin 60. COPYRIGHT: (C)2004,JPO&NCIPI |
