| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device having high reliability and a method for manufacturing the same, and also to provide a circuit substrate and an electronic apparatus. <P>SOLUTION: The semiconductor device includes a semiconductor chip 10 having a plurality of bumps 12, and a substrate 20 having a plurality of leads 30. At least one of the leads 12 is a batch connecting lead 32 connected to two or more bumps 14 aligned in its widthwise direction. The batch connecting lead 32 has two or more first parts 16 overlapping with the bumps 14, and a second part 18 bridged between the adjacent first parts 16 and connected to the first parts 16. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
