| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for bonding a microchip substrate which is produced from a plastic material and has a microchannel on the surface without blocking the microchannel by an adhesive, contaminating the inner wall, and damaging involved devices, and a microchip which can be produced by the method. SOLUTION: In this method for bonding the microchip substrate 1, two microchip substrates are cohered in the state that the substrates are finally bonded. A solution 4 containing a masking reagent is injected into the microchannel, and at least a part of the inner wall of the microchannel is masked. The microchip substrate is separated into two, and an adhesive which is involved in the microcapsule or is a micelle is applied to the bonded part of at least one of the separated microchip substrates. After the microchip substrates are bonded, the masking reagent of the inner wall of the microchannel is removed. The microchip is produced by the method. COPYRIGHT: (C)2004,JPO&NCIPI
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