| 摘要 |
PROBLEM TO BE SOLVED: To provide a conveying device capable of preventing an adhesion of particles or the like to a substrate. SOLUTION: A substrate handling mechanism 16 arranged inside a conveying chamber which a cluster substrate processing system including a substrate processing device and a wafer conveying-in-and-out chamber has comprises a cylindrical rotor 20, an arm 21 which is a rod, and a gripping part 22 for gripping a substrate W. The rotor 20 is connected to a floor surface of the conveying chamber rotatably on its center seen from above the cluster substrate processing system, the arm 21 is connected to the vicinity on an outer edge of the rotor 20 with its one end, and a gripping part 22 is rotatably connected to the other end of the arm 21. When the substrate W is conveyed by the substrate handling mechanism, the rotor 20, the arm 21, and the gripping part 22 convey the substrate W to the predetermined position of the substrate processing device and the wafer conveying-in-and-out chamber in collaboration. COPYRIGHT: (C)2004,JPO&NCIPI
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