| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for use in encapsulation of an electronic component that has superior moldability and provides a hardened product of low water absorption. SOLUTION: This epoxy resin composition comprises an alicyclic epoxy compound (a) represented by general formula (1) (wherein R<SP>1</SP>-R<SP>18</SP>may be the same or different and are each a hydrogen atom, a halogen atom, a hydrocarbon group which may contain an oxygen atom or a halogen atom or an alkoxy group which may have a substituent) and a hardener (b) as an essential component, and a hardening accelerator (c), an inorganic filler (d) and another epoxy resin (e) as required. COPYRIGHT: (C)2004,JPO&NCIPI
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