| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition which does not substantially contain Br/Sb and exhibits excellent high-temperature crack resistance and moisture resistance reliability when used for sealing a semiconductor device, e.g., of a surface mounting type. SOLUTION: The resin composition for sealing essentially contains (A) an epoxy resin having a biphenylaralkyl backbone, (B) a phenol resin curative having a triphenylmethane structure, (C) a cure accelerator such as DBU (1,8 diazabicyclo[6,4.0]undecene-7), (D) silica, and (E) a coupling agent such asγ-N-phenylaminopropyltrimethoxysilane and does not contain a brominous flame retardant and an antimony compound. The resin-sealed semiconductor device prepared by sealing a semiconductor chip with a cured product of the composition is also provided. COPYRIGHT: (C)2004,JPO&NCIPI
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