发明名称 Transfer material transfer process, shape transfer process and transfer device
摘要 A transfer device in which a material which transmits a laser beam LB is employed as an upper mold, and a photothermal conversion layer is formed thereon. A transfer film, at which a transfer material layer is formed, and a workpiece are superposed and pressured between the upper mold and a lower mold. During this pressuring, the laser beam is irradiated in accordance with a pattern of an organic electroluminescent light-emitting layer that is to be formed on the workpiece. Thus, the photothermal conversion layer is heated and the transfer material layer is softened. As a result, the transfer material layer is cleaved and detached from a temporary support, and a component in the transfer material layer that is to form the organic electroluminescent light-emitting layer is transferred to the workpiece. Accordingly, efficient transfer processing is enabled when a transfer material is transferred to a transfer object by a thermal imaging process.
申请公布号 US2004142273(A1) 申请公布日期 2004.07.22
申请号 US20030702476 申请日期 2003.11.07
申请人 NISHIDA HIROYUKI;ENDO KEISUKE 发明人 NISHIDA HIROYUKI;ENDO KEISUKE
分类号 B41J2/32;B23K26/00;B23K26/18;B32B37/00;B32B37/30;B41M1/40;B41M5/00;B41M5/035;B41M5/26;B41M5/382;B41M5/46;H01L51/50;H05B33/10;(IPC1-7):G03F7/34;B44C1/165;B27G11/02;B32B31/24;B30B15/34;G03B13/00 主分类号 B41J2/32
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