发明名称 Semiconductor device having pad
摘要 In a semiconductor device having a pad, a first conductor and a second conductor are arranged at a surface of the pad. The first conductor has hardness that is greater than that of the second conductor and not less than that of a probe stylus. The first conductor is arranged at the surface of the pad such that the probe stylus hits or rubs against the first conductor at least one time while the probe stylus is in contact with and sliding on the surface of the pad.
申请公布号 US2004140467(A1) 申请公布日期 2004.07.22
申请号 US20030612066 申请日期 2003.07.03
申请人 RENESAS TECHNOLOGY CORP.;KYOEI SANGYO CO., LTD. 发明人 KIMURA NAOKI;SUGIHARA KEIJI
分类号 H01L21/66;H01L21/3205;H01L23/485;H01L23/52;H01L23/58;(IPC1-7):H01L23/58 主分类号 H01L21/66
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