| 摘要 |
A chip module mounted on a circuit board has a chip mount pad, a chip, a number of leads, and an insulative element. The chip mount pad has a receiving portion and a supporting portion. The receiving portion defines a receiving surface and a heat dissipation surface opposite the receiving surface. The receiving surface faces the circuit board. The supporting portion extends from the receiving portion to the circuit board, and has a distal end fixed on the circuit board. The insulative element is fixed on the receiving surface of the receiving portion of the chip mount pad, and the heat dissipation surface is exposed. Therefore, the chip module of the present invention can be firmly mounted on the circuit board, and heat dissipation efficiency of the chip module is improved. |
