发明名称 THERMOELECTRIC MODULE
摘要 PROBLEM TO BE SOLVED: To provide a thermoelectric module which is superior in wire bondability and durability and can be manufactured at low cost. SOLUTION: By plating or the like, lower electrodes 3 are formed on a lower substrate 1 made of an insulating material such as ceramics, and upper electrodes 4 are formed on an upper substrate 2 made of the same material as that of the lower substrate. Then, the lower substrate 1 and the upper substrate 2 are positioned in parallel with each other so that the lower electrodes 3 face the upper electrodes 4. Next, multiple thermoelectric elements 5 are positioned between the upper and lower electrodes. At this time, a pair of thermoelectric elements (a p-type thermoelectric element 5a and an n-type thermoelectric element 5b) are joined to each lower electrode 3, and the top of a p-type thermoelectric element 5a and that of an n-type thermoelectric element 5b, which are adjacent to each other of the pairs of thermoelectric elements on adjacent lower electrodes, are joined to an upper electrode 4, thereby connecting p-type thermoelectric elements and n-type thermoelectric elements in series. An Au wire is bonded to each of external connecting terminals 6, formed on the lower substrate 1 so that they are respectively brought into contact with a lower electrode 3, to which one of the thermoelectric elements at both ends of the series-connected thermoelectric elements is bonded and thus a thermoelectric module is made. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004207717(A) 申请公布日期 2004.07.22
申请号 JP20030415046 申请日期 2003.12.12
申请人 YAMAHA CORP 发明人 ONOE KATSUHIKO
分类号 F25B21/02;H01L35/08;H01L35/10;(IPC1-7):H01L35/10 主分类号 F25B21/02
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