| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip having a thin thickness and high heat radiating performance which is suitable for small, light and thin electronic equipment, and to provide a semiconductor device and their manufacturing methods. SOLUTION: This semiconductor chip S has a structure wherein a heat radiating element 5 composed of numbers of radiating fins 4 is formed in the rear face 3 of a semiconductor substrate 1 which is the opposite side to the active face 2 of the semiconductor substrate 1 in which an integrated circuit is formed. COPYRIGHT: (C)2004,JPO&NCIPI |
