发明名称 |
Semiconductor device and method of fabrication thereof, optical module and method of fabrication thereof, circuit board, and electronic instrument |
摘要 |
A semiconductor device includes: a substrate on which is formed an interconnecting pattern; a first semiconductor chip provided above the substrate and having a first electrode on a surface facing the substrate; and a second semiconductor chip provided above the first semiconductor chip and having a second electrode on a surface facing the substrate. The substrate has a bent portion inclined from the first electrode to the second electrode. The interconnecting pattern extends along the bent portion and electrically connected to the first and second electrodes. |
申请公布号 |
US2004142539(A1) |
申请公布日期 |
2004.07.22 |
申请号 |
US20030687548 |
申请日期 |
2003.10.15 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
KOIZUMI MASANORI |
分类号 |
H01L27/14;H01L21/60;H01L25/065;H01L25/07;H01L25/18;H01L27/146;H01L31/02;H01L31/0203;H01L31/0232;H01L33/44;H01L33/48;H01L33/58;H04N5/225;H04N5/335;H04N5/372;H04N5/374;(IPC1-7):H01L21/30 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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