Verfahren zum Herstellen einer Kontaktanordnung für eine Vakuumschaltröhre

摘要

A contact piece (10,20) is pressed directly onto the surface of a contact carrier (1,2), leaving a gap along the contact surface. A solder material is arranged in regions directly adjoining the gap, between the contact piece and contact carrier. Under vacuum, the solder material is melted by heating and the molten material penetrates the gap between the contact carrier and the contact piece.