METHODS FOR POLISHING AND/OR CLEANING COPPER INTERCONNECTS AND/OR FILM AND COMPOSITIONS THEREFOR
摘要
<p>The present invention provides methods of polishing and/or cleaning copper interconnections using bis (perfluoroalkanesulfonyl) imide acids or tris (perfluoroalkanesulfonyl) methide acids compositions.</p>
申请公布号
WO2004061028(A1)
申请公布日期
2004.07.22
申请号
WO2003US34259
申请日期
2003.10.28
申请人
3M INNOVATIVE PROPERTIES COMPANY
发明人
KESARI, SUSRUT;LAMANNA, WILLIAM, M.;PARENT, MICHAEL, J.;ZAZZERA, LAWRENCE, A.