| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a manufacturing method for an unleaded solder bump of a low processing cost and easy control for plating, by which the unleaded solder bump of a binary field or a ternary field can be easily manufactured only by tinning of a single field or a binary field, by diffusing copper into solder when reflowing the solder. <P>SOLUTION: The manufacturing method for the unleaded solder bump includes a step of providing a wafer 10 having a protective layer 14 with an opened electrode pad 12; a step of forming a metallic base layer 20 on the wafer 10; a step of providing lithography to a photoresist 30 on the metallic base layer 20 removing a part corresponding to the electrode pad 12; a step of forming a copper layer on the metallic base layer 20 corresponding to the electrode pad 12; a step of plating the solder on the copper layer; a step of removing the photoresist 30; and a step of etching the metallic base layer 20 by using solder with a mask and manufacturing the solder dump by reflowing the solder on the other hand. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
