Method for connection of semiconductor devices on common substrate e.g. for automobile applications, requires conductive flat contact stirrup between first and second semiconductor devices

摘要

A method for electrical connection of at least two semiconductor devices (1,2) having electrical connection elements (51) and mounted on a common substrate carrier (5). An electrically conductive flat contact stirrup (61) is arranged between the first semiconductor device (1) and the component rear-face of the second semiconductor device (2), and the contact stirrup (61) is connected in the region of the first section to the first upper contact surface (121) of the first semiconductor device (1) and the lower contact surface (21) of the second semiconductor device (20 so that two opposite lying surfaces of the contact stirrup (61) are used. Independent claims are included (a) for a power-semiconductor component and (b) for a multi-chip arrangement.