| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a simple method for processing a workpiece remarkable in points that a solid material is uniformly formed, and the workpiece and a workpiece carrier are easily separated, and also to provide the workpiece carrier particularly used for this method. <P>SOLUTION: A description is particularly made on a method for fixing the processing workpiece 52 to the workpiece carrier 10 by using the solid material 62. This workpiece carrier 10 is composed of a porous substance (for example, porous ceramics). A wafer is easily used in processing by this processing method. This workpiece 52 is also easily separated by using a solvent of the workpiece carrier 10. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
