| 发明名称 |
LIQUID EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain an epoxy resin composition good in moistureproofness, adhesivity and storing stability, and suitable for sealing a semiconductor device. <P>SOLUTION: The liquid epoxy resin composition for sealing the semiconductor comprises a liquid epoxy resin (c) and a compound (a) represented by formula (1). <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
| 申请公布号 |
JP2004204169(A) |
申请公布日期 |
2004.07.22 |
| 申请号 |
JP20020377604 |
申请日期 |
2002.12.26 |
| 申请人 |
HITACHI LTD;HITACHI CHEM CO LTD |
发明人 |
OKABE YOSHIAKI;ISHII TOSHIAKI;HAGIWARA SHINSUKE |
| 分类号 |
C08G59/50;H01L23/29;H01L23/31;(IPC1-7):C08G59/50 |
主分类号 |
C08G59/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
