发明名称 CUTTING-OFF METHOD AND EQUIPMENT OF SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To improve productivity of preparations by enabling effective production of a package 2 (preparations) when a fabricated substrate 1 is cut off and each package 2 is separated and formed by using cut-off equipment of a substrate. SOLUTION: Firstly, the fabricated substrate 1 is transferred to a platform 14 installed in the cutting-off equipment and sucked and fixed. In the state that the substrate 1 is sucked and fixed, the cleavage site 9 of the substrate 1 is cut by using a shearing blade 17. Each package 2 is separated and formed from the substrate 1. Secondly, each of the packages 2 cut from the substrate 1 is sucked and engaged by using transport mechanism G installed in the cutting-off equipment. In the state that each of the packages 2 is sucked and engaged, steam is jetted against each of the packages 2, thereby cleaning it. Pressure-feeding of the air is performed to the cleaned package 2, thereby drying it. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004207424(A) 申请公布日期 2004.07.22
申请号 JP20020373606 申请日期 2002.12.25
申请人 TOWA CORP 发明人 KAWAMURA KOICHI;IWATA YASUHIRO;HARADA AKIYUKI
分类号 H01L21/301;(IPC1-7):H01L21/301 主分类号 H01L21/301
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