| 摘要 |
PROBLEM TO BE SOLVED: To provide an inner layer material for a printed wiring board having a structure which can contribute to increase a production yield. SOLUTION: In the inner layer material 1a, the border line 17 of a copper foil missing part 5 and a copper foil residual part 6 in an outside region 3 intersects the edges 4a-4d of the inner layer material at an angle of 45°-90°at least on one surface, i.e. surface A, and since the border lines 17 consist of radial lines starting from point P in an inner layer circuit forming part 2, force is not applied at an angle of 45°or above to any border line 17 at the time of carriage even if any edge 4a-4d of the inner layer material 1a becomes a forward edge in the carrying direction. Since bending is prevented along the border line 17, a higher strength can be ensured at carrying time. COPYRIGHT: (C)2004,JPO&NCIPI |
