| 摘要 |
PROBLEM TO BE SOLVED: To provide an etching apparatus by which the dispersion of etching rates can be reduced as small as possible in forming a wiring pattern on a printed circuit board. SOLUTION: In the etching apparatus, 21 nozzles 1 for ejecting an etchant are installed on a plate member that swings in the direction rectangularly crossing the transfer direction of a substrate 2 (e.g., copper thinly formed on a polyimide film) in a manner that all of the positions of swing direction are different from each other. The times of swing of the nozzles per minute are set so that the transfer rate of the substrate 2 may be equal to the value resulting by dividing the pitch among the nozzles in the transfer direction by an integer. Therefore, the loci of the centers of the respective nozzles drawn on the substrate 2 do not cross or coincide with each other. It does not therefore happen that the etching rate is extremely high at the crossing or coincidence, which can reduce the dispersion of etching rates. COPYRIGHT: (C)2004,JPO&NCIPI
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