| 摘要 |
PROBLEM TO BE SOLVED: To obtain a phenolic resin adhesive composition having excellent rapid curability and adhesiveness, reduced in the tendency to emit formaldehyde, and having no tendency to infiltrate. SOLUTION: This phenolic resin adhesive composition contains dispersed particles of a water-dispersible phenolic resin (a) having such a high degree of condensation as to be insoluble in a highly alkaline solution having pH at 13.9. COPYRIGHT: (C)2004,JPO&NCIPI
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