Mounting structure of electronic device

摘要

A circuit substrate comprises a terminal electrode having minute dents on its mounting surface, and a conductive adhesive provided on the surface of the terminal electrode. The conductive adhesive comprises conductive particles each having sizes so as to get in the minute dent. Thus, an electrical contact or a bonding area between the circuit substrate and the mounting device is enlarged and then connection reliability in a mount body of an electronic device is improved.