发明名称 SYSTEM FOR TREATING SUBSTRATE AND SUBSTRATE DRYER
摘要 A horizontal carriage type substrate treating system where a substrate is carried in the horizontal direction to pass through a plurality of treating sections, wet treatment is conducted at at least one of a plurality of treating sections and a section for cutting liquid by means of an air knife is provided on the downstream side of the wet treatment section. In the substrate treating system, the substrate is supported stably in the vicinity of an air knife slit nozzle 52 and the circuit is protected effectively against breakdown due to charging. For that purpose, the air knife slit nozzle 52 disposed in a liquid cut section is inclined sideward in the plan view and free rollers 67A, 67B for supporting the substrate are distributed in right triangular dead spaces formed on the upstream side or downstream side of the slit nozzle 52 or spaces including the dead space. At least the free roller 67B on the downstream side is composed of a conductive material and grounded electrically.
申请公布号 KR20040065572(A) 申请公布日期 2004.07.22
申请号 KR20047008588 申请日期 2001.12.13
申请人 发明人
分类号 G02F1/13;H01L21/00 主分类号 G02F1/13
代理机构 代理人
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