| 摘要 |
PROBLEM TO BE SOLVED: To provide a sputtering target capable of realizing an Al alloy target for performing a sputtering in a stable state hardly causing abnormal discharge, thereby drastically improving the in-plane uniformity of the thickness of the obtained Al alloy film, to provide the Al alloy film having uniform characteristics even when the sputtering area is large by using the sputtering target, and to provide an electronic component using the Al alloy film. SOLUTION: The Al alloy sputtering target mainly consists of Al and contains at least one kind of metal element selected from Y, Nd, Ta, Ti, Zr, Cr, Mn, W, Mo, Fe, Co, Ni, Cu, Ag, Si and Ge. Dispersion of the Vickers hardness on the sputter surface is≤20%. COPYRIGHT: (C)2004,JPO&NCIPI
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