发明名称 BUFFER PACKAGING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a buffer packaging material consisting of an upper packaging material, a lower packaging material, and auxiliary packaging materials, in which the auxiliary packaging materials are supported and fixed stably between the upper and lower packaging materials, so that the buffer material can be applied well to a plurality of kinds of articles with different shapes. SOLUTION: The buffer packaging material consists of the lower packaging material 1, the upper packaging material 2, and the auxiliary packaging materials 3, which are made of a synthetic resin expanded material, respectively. Housing recessions 12, into which the lower part of the article can be inserted, are formed on the upper surface of the lower packaging material 1, while housing recessions 22, into which the upper part of the article can be inserted, are formed on the lower surface of the upper packaging material 2. Each auxiliary packaging material 3, having a housing space for housing another article inside, is supported and fixed between the upper and lower packaging materials by fitting at least either the upper or lower part of the auxiliary packaging material into the housing recession 22 of the upper packaging material 2 or the housing recession 12 of the lower packaging materail 1. COPYRIGHT: (C)2004,JPO&NCIPI
申请公布号 JP2004203439(A) 申请公布日期 2004.07.22
申请号 JP20020375623 申请日期 2002.12.25
申请人 SEKISUI PLASTICS CO LTD 发明人 WAKAO TATSUYA
分类号 B65D81/113;B65D85/86;(IPC1-7):B65D85/86 主分类号 B65D81/113
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