PHOTOCURABLE THERMOSETTING CONDUCTIVE COMPOSITION, CONDUCTIVE CIRCUIT FORMED FROM THE CONDUCTIVE COMPOSITION, AND METHOD OF FORMING THE SAME

摘要

A photocurable thermosetting conductive composition for conductive circuit formation which comprises conductive particles (A), an organic binder (B), a photopolymerizable monomer (C), a photopolymerization initiator (D), and a solvent (E), characterized in that the proportion of the conductive particles (A) is 75 to 90 wt.% based on the composition excluding the solvent (E) and that the composition excluding the conductive particles (A) and the solvent (E) has an acrylic (methacrylic) equivalent of 800 or lower.