| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package for storing a light emitting element in which transparent resin can be fixed rigidly to a recess in a substrate, and to provide a light emitting device. <P>SOLUTION: In the package for a light emitting element, wiring layers 5a (a mounting part 2) and 5b being connected electrically with a light emitting element 3 are formed from the bottom face of a recess 4 to the lower surface of an insulating substrate 1 having an upper surface in which the recess 4 for mounting the light emitting element 3 is formed. A plurality of holes 8 being filled with transparent resin are formed, at a constant interval, in the outer circumferential part on the bottom face of the recess 4 in the insulating substrate 1. The hole 8 is provided with a level difference 8a on the inner circumferential surface or the inner dimension of the hole 8 is larger on the lower side than on the upper side. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
