| 摘要 |
PROBLEM TO BE SOLVED: To prevent the damage of a semiconductor wafer by facilitating a handling without increasing a production cost when the thin and breakable semiconductor wafer, is divided into each semiconductor chip. SOLUTION: When the semiconductor wafer, in which a plurality of circuits are formed to a surface, is divided into the semiconductor chips at every circuit, the surface of the semiconductor wafer W is faced oppositely to the top face of a supporting substrate 11 supporting the wafer, and the wafer W and the substrate 11 are integrated through a pressure-sensitive adhesive 10, the rear of the wafer W is polished under the state in which the wafer W is integrated with the substrate 11, the wafer W is divided into each semiconductor chip from the rear side under the state in which the wafer W is integrated with the substrate 11, and the semiconductor chips are picked up from the substrate 11. Since the wafer W is supported to the substrate at all times, the wafer W is not damaged. COPYRIGHT: (C)2004,JPO&NCIPI |
