| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip bonding apparatus capable of accurately adjusting the parallelism between bonding faces in a short time. SOLUTION: The chip bonding apparatus is provided with a bonding tool for supporting a chip, a work stage 4 for supporting a circuit board 2, an imaging means for acquiring an image of both opposed faces of the chip and the circuit board, a light emission means for emitting light to both the opposed faces in an oblique direction, and a parallelism adjustment means for adjusting a relative angle of both the opposed faces. A camera for acquiring a video image for alignment purpose catches a marking point indicated by the light emission means to adjust the parallelism. Since no mechanical operation is required for switching between the alignment and the parallelism adjustment and momentary electric switching is attained in this way, the time required for the bonding work can be decreased and the chip bonding apparatus suitable for mass-production can be obtained. COPYRIGHT: (C)2004,JPO&NCIPI
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