| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing the flowability and normal temperature stability of which can be improved and the curing time of which can be decreased without detriment to its mechanical characteristics and reliability; and to provide an electronic component sealing device using the composition. SOLUTION: The epoxy resin composition essentially comprises (A) an epoxy resin, (B) a phenol resin, (C) an organophosphorus compound represented by the formula (wherein R is an alkyl or methoxy), and (D) an inorganic filler, the content of inorganic filler (D) being 30-95 wt.% based on the total amount of the composition. The electronic component sealing device sealed with a cured product of the composition is also provided. COPYRIGHT: (C)2004,JPO&NCIPI
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