METHOD FOR MANUFACTURING IC CARD BY LAYERING FOILS

摘要

PURPOSE: A method for manufacturing an IC card by layering foils is provided to exclude a step digging out a groove after layering the foils, make no gab between a COB(Chip On Board) and a card plate, and strongly combine the COB and the card plate, and the electrodes of the COB and an antenna. CONSTITUTION: An antenna foil(400) forms the first hole(401) exposing a molding part(220) of the COB(200) and an antenna electrode(212), and is wound by the antenna at one side in order to expose both ends of the antenna to the inside of the first hole. The first hole is inserted into the molding part of the COB in order to expose the molding part of the COB and the antenna electrode. A connection part(411) of the antenna is electrically connected to the antenna electrode of the COB. The foil(600) having no hole is layered on the antenna foil. The layered foils are compressed/adhered with each other.