| 摘要 |
The method involves cutting a part (2) of a circuit board (1) out of the board, fitting components to the circuit board and to the part that has been cut out and joining (3) the cut-out part to the circuit board in an offset position. Surface mounted device components can be fitted to the circuit board and through hole technology components to the cut-out part. AN Independent claim is also included for the following: (a) an electronic device with a circuit board manufactured by the inventive method. |
