发明名称 Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method
摘要 Single-sided conductor patterned films 21 are prepared, each of which has a conductor pattern 22 formed only one side of a resin film 23 and via hole 24 filled with conductive paste 50. A single-sided conductor patterned film 31 which has a conductor pattern 22 formed only one side of a resin film 23 and an opening formed in the resin film 23 so as to expose an electrode 32 is laminated on the single-sided conductor patterned films 21. Moreover, a cover layer with an opening to expose an electrode 37 is laminated on a bottom surface of the single-sided conductor patterned films 21 to form a laminate. Then, by pressing the laminate while heating, a multilayer substrate 100 having the electrodes at both sides thereof can be produced. <IMAGE> <IMAGE> <IMAGE> <IMAGE> <IMAGE>
申请公布号 EP1215948(A3) 申请公布日期 2004.07.21
申请号 EP20010129757 申请日期 2001.12.13
申请人 DENSO CORPORATION 发明人 KONDO, KOJI;KAMIYA, TETSUAKI;HARADA, TOSHIKAZU;ONODA, RYUICHI;KAMIYA, YASATAKA;MASUDA, GENTARO;YAZAKI, YOSHITARO;YOKOCHI, TOMOHIRO
分类号 H05K3/28;H05K1/11;H05K3/00;H05K3/40;H05K3/46 主分类号 H05K3/28
代理机构 代理人
主权项
地址