发明名称 COOLING APPARATUS
摘要 PURPOSE: A cooling apparatus is provided to improve a heatproof efficiency by increasing a surface area. CONSTITUTION: A cooling apparatus(160) comprises a plate, a plurality of perpendicular pillar(164) extended with a same interval on the plate, a dummy plate(162) covering the perpendicular pillar, and a plurality of protrusion part(166) protruded from each of a bottom surface of the plate and both surfaces of the perpendicular pillars. The each of the perpendicular pillars is extended with perpendicular and with a zigzag type on the plate. An intelligent Power Module(IPM)(142) is equipped at a rear surface of the plate. The dummy plate is set up at a front surface of the perpendicular pillars to intersect with a same spacing about the perpendicular pillars and covers a center part of the perpendicular pillar except for an edge of the perpendicular pillars.
申请公布号 KR20040064995(A) 申请公布日期 2004.07.21
申请号 KR20030002071 申请日期 2003.01.13
申请人 LG ELECTRONICS INC. 发明人 KIM, YANG HYEON;LEE, WON YEOP
分类号 H01J17/28;H01J11/10;(IPC1-7):H01J17/49 主分类号 H01J17/28
代理机构 代理人
主权项
地址