发明名称 |
Thermal characterization chip |
摘要 |
A thermal characterization chip comprising a substrate having overlying electronics, the electronics including semiconductor circuitry and thin film circuitry overlying the semiconductor circuitry; wherein the electronics define a plurality of thermal domains, each of the domains defining a portion of a receiving surface for receiving an external influence that alters a thermal parameter within the thermal domains; and wherein the electronics further comprises monitoring circuitry for monitoring the thermal parameter in each of the thermal domains over a test time period. <IMAGE>
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申请公布号 |
EP1439483(A1) |
申请公布日期 |
2004.07.21 |
申请号 |
EP20030016821 |
申请日期 |
2003.07.23 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
PRAKASH, SATYA;CORRIGAN III, GEORGE H. |
分类号 |
G01K7/16;G01K1/20;G06K9/00;H01L21/822;H01L27/04;(IPC1-7):G06K9/00 |
主分类号 |
G01K7/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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