发明名称 Thermal characterization chip
摘要 A thermal characterization chip comprising a substrate having overlying electronics, the electronics including semiconductor circuitry and thin film circuitry overlying the semiconductor circuitry; wherein the electronics define a plurality of thermal domains, each of the domains defining a portion of a receiving surface for receiving an external influence that alters a thermal parameter within the thermal domains; and wherein the electronics further comprises monitoring circuitry for monitoring the thermal parameter in each of the thermal domains over a test time period. <IMAGE>
申请公布号 EP1439483(A1) 申请公布日期 2004.07.21
申请号 EP20030016821 申请日期 2003.07.23
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. 发明人 PRAKASH, SATYA;CORRIGAN III, GEORGE H.
分类号 G01K7/16;G01K1/20;G06K9/00;H01L21/822;H01L27/04;(IPC1-7):G06K9/00 主分类号 G01K7/16
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