发明名称 WIRING MATERIAL INCLUDING BINDER LAYER AND WIRING LAYER, WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF, DISPLAY PANEL, FINE PARTICLE THIN FILM MATERIAL, SUBSTRATE INCLUDING THIN FILM LAYER AND MANUFACTURING METHOD THEREOF
摘要 PURPOSE: A wiring material, a wiring substrate and a manufacturing method thereof, a display panel, a fine particle thin film material, a substrate including thin film layer and a manufacturing method thereof are provided to reduce resistance of wiring and achieve improved adherence between a wiring and a substrate. CONSTITUTION: A wiring material comprises a first layer including conductive fine particles, wherein the first layer has a function of a binder for adherence to a substrate(1); and a second layer including conductive fine particles, wherein the second layer is formed on the first layer. A wiring substrate includes a first layer, a second layer, and an anchor member arranged at the boundary between the first layer and the second layer, wherein the anchor member is made of an integrated material of conductive fine particles and conductive material, and combines the first layer and the second layer.
申请公布号 KR20040065175(A) 申请公布日期 2004.07.21
申请号 KR20040002295 申请日期 2004.01.13
申请人 SHARP CORPORATION 发明人 FUJII AKIYOSHI;TAHIRA TOSHIO;NAGAE NOBUKAZU
分类号 H05K1/09;B32B5/16;H05K3/10;H05K3/24;(IPC1-7):H05K1/09 主分类号 H05K1/09
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