发明名称 |
Integrated circuit bonding device and manufacturing method thereof |
摘要 |
An integrated circuit device. The substrate includes a signal connection point and two shielding connection points set at the two sides of the signal connection point. The chip is set on the substrate. There are a signal pad and two shielding pads set at the two sides of the signal pad on the edge of the chip. The signal wire bonding is coupled to the signal connection point and the signal pad. Two shielding wire bondings are coupled to the shielding connection points and the shielding pads and extend along both sides of the signal wire bonding. The signal trace line is set on the substrate and coupled to the signal connection point. The power ring circuit is set on the substrate and coupled to the shielding connection points. The power circuit includes two shielding lines extending along both sides of the signal trace line.
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申请公布号 |
US6765301(B2) |
申请公布日期 |
2004.07.20 |
申请号 |
US20020212106 |
申请日期 |
2002.08.06 |
申请人 |
SILICON INTEGRATED SYSTEMS CORP. |
发明人 |
WU CHUNG-JU;LIANG KUEI-CHEN;LIN WEI-FENG |
分类号 |
H01L23/498;H01L23/552;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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